Atomic Layer Deposition (ALD) based thin films are conformal and pinhole-free and therefore ideally suited for demanding thin film applications. ALD can be applied to a wide range of products in order to improve their quality, increase yield, reduce manufacturing wastage and reduce manufacturing costs. Typical application examples include encapsulation of flexible photovoltaics, OLEDs and food packaging. The cost of conventional multilayer barrier films are prohibitively high for such applications; a single layer inorganic barrier film, can be produced by roll-to-roll ALD technology thus providing a cost-efficient solution.
NanoMend is specifically looking at ways to apply atomic layer deposition technologies to aseptic packaging and photovoltaic applications.
For paper packaging, the objective for the application of ALD is to increase the shelf life of packaging through improving the performance and yield of thin barrier layers. The technology also seeks to reduce material wastage during production.
The objectives for photovoltaics applications is to use ALD to improve process control and encapsulation which will lead to enhance yields, improved efficiency and extended product lifetimes in the roll-to-roll manufacture of lightweight, flexible PV modules.