Lappeenranta University of Technology (LUT), Tampere University of Technology (TUT) and Stora Enso are collaborating together in the development of higher performing barrier protection against water vapour and oxygen for paper and applications using atomic layer deposition (ALD).
This flyer focuses on ALD technologies for paper packaging. The objective for the application of ALD is to increase the shelf life of packaging through improving the performance and yield of thin barrier layers. The technology also seeks to reduce material wastage during production.
ALD is a thin-film deposition process, normally at the nanoscale, which is characterised by exceptionally high levels of:
- Thickness control
With 30nm thick Al2O3 coating, O2 TR of BOPP film was decreased from 1100cm3/m2/24h down to 20cm3/m2/24h at 23°C, 0%RH.
ALD can be applied to a wide range of products in order to improve their quality, increase yield, reduce manufacturing wastage and reduce manufacturing costs. Some of the potential applications aside from food packaging (aseptic) include:
- Flexible photovoltaics
- Flexible displays
- Interactive packaging
- Flexible and printed electronics